Industrial Electronics

Emis has created a range of three phase, dual stage EMC filters designed for industrial motor and drive systems across 5 to 170kW. TMF3221 and TMF3222 “are housed in a space-saving slim book-shelf enclosure which may be installed next to inverters, converters or motor drives”, according to the company. “The devices are designed to meet the needs of power drive ...

Shanghai-based WeEn Semiconductors unveiled 650V and 1,200V IGBTs with fast recovery anti-parallel diodes at PCIM in Nuremberg. “Based on fine trench gate field-stop technology, the IGBTs provide a more uniform electric field within the chip, support higher breakdown voltages and offer improved dynamic control,” according to the company. “A positive temperature coefficient simplifies parallel operation.” Ratings are 650V 75A, 1.2kV ...

Infineon has announced a flurry of new power products as a prelude to PCIM in Nuremberg next week, the latest of which is a family of 600V super-junction mosfets. Its eighth generation, “the devices combine the best features of the 600V CoolMOS 7 series and are the successors to the P7, PFD7, C7, CFD7, G7 and S7 product families”, according ...

Infineon is putting 650V silicon carbide mosfet die into two packages with SO-type footprints: a thin (1.5mm) bottom-cooled 8 x 8mm leadless TO (TOLL – TO leadless), and 9.8 x 15 x 2.3mm 16 leg SO version with top-side cooling (‘TOLT’ package) (see photo). Die with typical on-resistances of 20, 40, 50 or 60mΩ are available in either package, and ...

Nvidia will bring out  a new family of AI chips every year, says CEO Jensen Huang. The next one, called Rubin, containing networking  ICs, a GPU and a CPU (called Versa) will be out in 2026. ASRock Rack, ASUS, GIGABYTE, Ingrasys, Inventec, Pegatron, QCT, Supermicro, Wistron and Wiwynn will deliver cloud, on-premises, embedded and edge AI systems using Nvidia GPUs ...

EMI Solutions has introduced three-phase single-stage chassis-mount mains EMI filters aimed at common mode and differential mode suppression. Called the MF423-3W series, they come in four footprints: 1-10A: 85 x 51mm 15-40A: 128 x 121mm 50-60A: 100 x 107mm (pictured) 75-150A: 350 x 160mm Currents are at 40°C (range is -25 to +85°C) and in each case the first dimension ...

Banner Engineering has created an eight-port smart hub to couple 16 discrete input-outputs to a single IO-Link serial bus cable for industrial networks. “R130C is a compact top-exit IO-Link hub that allows connections for up to 16 non-IO-Link devices into an IO-Link system for industrial automation, sensor networks, supervisory control, data acquisition and IoT applications,” according to component distributor Mouser, ...

Nexperia has put 1,200V silicon carbide mosfet die into D2PAK-7 surface mount package, also known as TO-263-7. “SiC switches in SMD packages like D2PAK-7 [are] becoming increasingly popular in industrial applications including electric vehicle charging, uninterruptible power supplies and inverters for solar and energy storage.” NSF0xx120D7A0 is the SiC mosfet family name, and they come with different on-resistances: NSF030120D7A0 30mΩ ...

Cosel has introduced a 3.5kW ac-dc 1U rack-mount power supply that will run from three phases between 180 to 528Vac. Two versions are available giving a choice of 48 or 65Vdc output, each trimmable +15% to -50% (24 to 55.2V, or 32.5 to 74.75V). Called HFA3500TF, the enclosed PSUs have three-wire inputs and will run from delta or star power networks. ...

Toshiba is aiming at industrial programmable logic controllers with fast surface-mount photocouplers that have hysteresis in the signal path. They are amplified types with threshold detection and an open-drain output. Operation is across -40 to +125°C and the secondary side will run from between 2.7 and 5.5V, consuming ~1mA. Operation is specified at 3.3 and 5V. Input-referred hysteresis is typically ...