Intel’s 18A has been found wanting by Broadcom after it ran test wafers on the process, reports Reuters. According to the report, Broadcom got the wafers back from Intel last month and decided that the process was not yet viable for high volume production. “Intel 18A is powered on, healthy and yielding well, and we remain fully on track to ...
Manufacturing
ESMC breaks ground on Dresden fab
ESMC – a jv between TSMC, Bosch, Infineon and NXP – broke ground for its first fab in Dresden yesterday, with the EU announcing it had approved a €5 billion subsidy from the German government for the €10 billion project. ”Together with our partners, Bosch, Infineon and NXP, we are building our Dresden facility to meet the semiconductor needs of ...
Scottish Renewables to guide wind turbine blade recycling
Scottish Renewables has joined the steering board of SusWind, the wind turbine blade recycling programme started in 2021 by the UK’s National Composites Centre (NCC) and the Offshore Renewable Energy (ORE) Catapult. On the steering board, “Scottish Renewables joins The Crown Estate, Crown Estate Scotland, BVG Associates, RenewableUK, ZeroWaste Scotland, Net Zero Technology Centre and Vestas”, said NCC. “Collectively, they ...
Chips Act fab projects delayed
Chips Act investments to boost semiconductor manufacturing are not seeing the expected results, point out the New York Times, Wall Street Journal and FT. In May 2020 TSMC announced plans to build a fab in Arizona with construction starting in 2021 and production on 4nm scheduled to start in 2024. Production has now been put back to 2025. The second fab was ...
Richard LeCain becomes CTO of UK’s battery manufacturing centre of excellence
Richard LeCain has been appointed chief technology officer at the UK Battery Industrialisation Centre (UKBIC). “Richard has more than 20 years of experience working in the battery industry, having previously held technical and leadership positions at A123 Systems and Britishvolt,” according to UKBIC. He “has worked in battery plants across the world, transferring processes and designs from the lab into ...
Alan Anderson signs CDIL for SiC and discrete semis
Hertfordshire UK contract manufacturer Alan Anderson Manufacturing has signed a deal with Continental Device India (CDIL) to supply discrete semiconductors including silicon carbide components. “We are taking a different approach to the supply of PCB assemblies,” said AA Manufacturing sales director Michael Knight. “We ensure supply by forging partnerships with our suppliers. When we get a BOM from a customer, ...
Terran Orbital commencing construction of 94,000 square foot facility
With the certificate of occupancy secured on the building’s construction, Terran Orbital – the satellite manufacturer – is commencing construction of a new space vehicle assembly facility. The 94,000 square feet building – situated on a five-acre site – is located at 4 Goodyear in Irvine, California. The company says it is targeting occupancy in Q1 2025. Terran says it ...
Intel moving second High NA EUV tool into Oregon
Intel is moving its second High NA EUV tool into its Oregon development fab. “As we move the Intel 4, Intel 3 capacity into Ireland, it also gives our TD (technical development) team more focus on their capital on 18A as well as then 14A and 10A, and we’re taking, for instance, the second high NA tool is coming into ...
TSMC to break ground on Dresden fab in August
TSMC will break ground on its first European fab in August, reports the Nikkei, with TSMC chairman and CEO C.CWei attending, “TSMC plans to hold the groundbreaking ceremony for the ESMC’s fab in Dresden, Germany, on August 20,” says TSMC, “this event represents a significant milestone for TSMC and our investment partners in the European semiconductor industry. The ESMC project ...
Axiom to design and build connected smart thermostat
Axiom Manufacturing Services is setting up to make a smart Internet-connected thermostat for Switchee “a British technology company that works with over 130 social housing providers”, said Axiom. Our “responsibilities will extend beyond the design of bespoke manufacture and test solutions and printed circuit board assembly, providing a full turnkey solution to ensure complete boxed products are delivered”, it continued. ...