Memory

The JEDEC Solid State Technology Association has published its JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, supporting the memory module configurations known as “raw cards” (JESD401-5B). This is consistent, says the standards body, with the recently updated contents of JESD401-5B DDR5 DIMM Label and JESD318 DDR5/LPDDR5 Compression Attached Memory Module (CAMM2) Common Standard. JESD406-5 The new publication documents the ...

A team from KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024. The KIOXIA engineering team, consisting of Hideaki Aochi, Ryota Katsumata, Masaru Kito, Masaru Kido, and Hiroyasu Tanaka, will accept this prestigious award for its pioneering work in developing and commercialising 3D flash memory. ...

JEDEC has unveiled its plans for advanced memory modules to enable future high-performance computing and AI applications. Specifically, the standards body has revealed details about its standards for DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6. The aim is to provide “unparalleled bandwidth and memory capacity”. Both projects are in development ...

Micron claims to have the world’s fastest datacentre SSD – the 9550 NVM SSD – which delivers 14.0 GB/s sequential reads, 10.0 GB/s sequential writes, and random reads of 3,300 KIOPS. The device supports a variety of AI workloads, including: GNN training with BaM, NVIDIA Magnum IO GPUDirect Storage, MLPerf and Llama LLM training fine tuning with Microsoft DeepSpeed. The SSD ...

Quinas, the startup founded by IQE and the universities of Lancaster and Cardiff, has received £1.1 million from Innovate UK to take UltraRAM further towards mass production. Invented by Lancaster physics professor Manus Hayne, UltraRAM technology is non-volatile with the speed, energy-efficiency, and endurance of  DRAM. Most of the funding for the one-year project will be spent at IQE which ...

JEDEC has published “JESD405-1B JEDEC Memory Module Label – for Compute Express Link (CXL) V1.1”, providing detailed guidelines for CXL memory modules. These modules are described as “end-user friendly hot pluggable assemblies” and are for data centres and similar server applications. They conform to SNIA (Storage Networking Industry Association) EDSFF form factors E1.S and E3.S. CXL Specifically, JESD405-1B defines the ...

Weebit Nano and Efabless have got together to enable fast and easy prototyping of  ICs using Weebit’s technology. Under the agreement, Efabless chipIgnite customers have access to Weebit’s ReRAM IP, an innovative non-volatile memory (NVM), which they can incorporate into their designs manufactured using SkyWater Technology Foundry’s 130nm CMOS (S130) process. chipIgnite is an  open-source chip design platform that claims ...

The latest figures from European Components Distribution (DMASS) show a decline in Q1 of 23.3% with semiconductor revenue dropping by 26.5%. DMASS Europe’s chairman, Hermann Reiter, was keen to stress there is no cause for alarm, saying that this market consolidation was long overdue. “Everyone should have prepared to weather a few quarters of weak bookings and billings,” he said, ...

We caught up with the Winbond team at Embedded World 2024 as part of our promotional coverage for the event. Jun Kawaguchi, Steam Lin and Tetsu Ho – discuss longevity for industrial memory, security for small form factor devices, their Fabs in Taiwan, and Winbond OctalNAND Flash… Jun Kawaguchi covers, for example, the company’s W77Q, a security flash memory with ...

The diverse challenges facing 5 distinct product segments. When it comes to electronics, most designs will involve multiple semiconductor devices. With this point in mind, Rochester Electronics’ goal is not to offer a single solution for an obsolete device, but instead provide a range of solutions covering the many mature devices likely found in designs. For example, finding a solution ...