Embedded World: Video Interview – Winbond on securing memory

We caught up with the Winbond team at Embedded World 2024 as part of our promotional coverage for the event.

Jun Kawaguchi, Steam Lin and Tetsu Ho – discuss longevity for industrial memory, security for small form factor devices, their Fabs in Taiwan, and Winbond OctalNAND Flash…

Jun Kawaguchi covers, for example, the company’s W77Q, a security flash memory with features securing OTA firmware updates from the cloud, while providing rollback protection for IoT devices….

Thank you to the Winbond team for their time.

Video: Priya Atwal, emap