Memory

Kioxia has begun sampling 64 and 128GB eMMC NAND for consumer applications which integrate the memory and a controller in one package. General availability is planned for October. Demand for mid-range capacities in consumer products continues to grow, and though the market continues to shift to UFS, there are cases where eMMC may still be used. The new eMMC devices ...

Micron is shipping  232-layer TLC NAND flash  fabbed in Singapore The device delivers I/O speed 2.4GB/s and the chip has a density of 14.6 Gb/mm2. The chip can store 1Tb which allows 2TB chip packages by stacking 16  232-layer dies. Micron has shrunk its packaging and a single chip package measures 11.5mm x 13.5mm (~155mm2).          

At Embedded World 2022, we caught up with Chengchi Lin, Sales Director at Longsys, as part of our promotional coverage for the event. FORESEE, the industry storage brand of Longsys, made its debut at Embedded World 2022. There is a full range of storage products, including for automotive electronics, industrial automation, power equipment, security monitoring, network communications equipment, and other ...

Teledyne e2v is shipping 4byte radiation-tolerant space-grade DDR4 memory. The device, called DDR4T04G72, is a 15 x 20 x 1.92mm multi-chip module that can operate at 2.4Gtransfer/s. Its bus assigns 64bits to data and an additional 8bits to error correction. The company sees it being used with its own Qormino processors, and the memories are compatible with “the vast majority of processors, ...

Hyperstone is sampling the S9 family of Secure Digital (SD) and microSD memory card controllers. The controller’s FlashXE ECC and hyReliability feature set guarantee extended endurance, data integrity and power fail safety coping with demanding applications in markets such as industrial automation, telecom, networking, and medical equipment. With the hyMap flash translation layer, the S9 achieves minimal write amplification and ...

Kioxia is sampling a 256GB NAND flash UFS memory supporting MIPI M-PHY v5.0. The eventual line-up will include 128GB, 256GB and 512GB devices. UFS (MIPI M-PHY 5.0 has a theoretical interface speed of up to 23.2Gbps per lane (x2 lanes = 46.4Gpbs) in HS-Gear5 mode. Sequential read and write performance of the 256GB device is improved by approximately 90% and ...

Intrinsic Semiconductor and its partner imec have scaled Intrinsic’s RRAM technology to 50nm. Intrinsic claims that, at 50nm, the technology demonstrates ‘excellent switching behaviour’. “We are delighted to have hit this critical milestone, confirming our theoretical analysis that the devices can be made with nanoscale dimensions,” says CEO Mark Dickinson, “ this means, at last, there will be a simple ...

Weebit Nano has demo-ed its first operational crossbar arrays, a key milestone on the Company’s path to creating discrete (stand-alone) non-volatile memory (NVM) chips. The 1T1R (one transistor one resistor) architecture used in embedded ReRAM arrays is not sufficient to support the large arrays of memory cells needed in discrete memory chips. For this reason, Weebit’s crossbar arrays were developed using ...

 Samsung says it has developed the industry’s first 14nm based 16Gb Low Power Double Data Rate 5X (LPDDR5X) DRAM. The LPDDR5X DRAM will offer data processing speeds of up to 8.5Gbps, which are over 1.3 times faster than LPDDR5’s 6.4Gbps. It will use around 20% less power than LPDDR5 memory and will enable up to 64GB per memory package.

Kioxia is now sampling select OEM customers with Enterprise and Data Center Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology. Features include: ● EDSFF E3.S form factor with capacities up to 7.68TB● Designed to the latest PCIe 5.0 specification and optimized for x2 PCIe lane performance● Using fewer PCIe lanes increases the number of PCIe devices that ...