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Testing

Smiths Interconnect offers wafer-level chip test probes

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Smiths Interconnect has introduced a range of probe heads for wafer-level chip-scale package testing. The probe heads in the Volta series are used for testing the chips while in their wafer form. In the design spring probe contacts are used in place of cantilever and traditional vertical probe card technologies. The am is to create a short signal path enabling ...

Magnetism essentials

 Electromagnetic component designs can be run in simulations to check them before prototyping, writes Andrew Adams Electronic transformers, inductors and magnetic materials are ubiquitous in many applications, from power adapters, laptops and mobile devices to car electronics, LED lighting, medical electronics and industrial controls. However, the enabling technology remains unsung. Many designers regard magnetic and electromagnetic components as ‘low tech’, ...

3GPP tester goes sub-6GHz for early 5G

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Rohde & Schwarz has a test instrument which can be used for validation of radio devices using the sub-6GHz 3GPP 5G new radio (NR) protocol. 3GPP’s 5G NR protocol will ultimately support frequency ranges up to 52.6GHz, but initial 5G designs will use frequencies below 6GHz with a focus on 3.5GHz. For these sub-6 GHz carrier frequencies, 3GPP currently discusses ...

Nvidia Cuda opens door to fast DSP in PCIe PCs

Spectrum SCAPP GPU DSP

Nvidia’s ‘Cuda’ graphics processors, with their high bandwidth PCIe interface, have opened the door to fast, but simple, instrumentation-grade DSP, according to Spectrum Instrumentation. Spectrum is a maker of digitisers – effectively low-noise multi-channel ADCs, some PCIe-based. Cuda is an Nvidia parallel number-crunching technology, that allows direct PCIe peripheral to GPU interaction without the host CPU getting involved. “Currently digitisers ...

PTP’s LabVIEW Architect to speak at NI Days

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A specialist in LabVIEW at Cambridgeshire-based Product Technology Partners will be  presenting at this year’s NI Days national conference at Sandown Park Racecourse, Esher, on Tuesday 28th November. David Barr, a Senior Systems Engineer at PTP, is one of a few LabVIEW Architects in the country and he will be offering a chance to discuss projects and problems in the ...

RF specialist expands teaching and test in South Yorkshire

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A Royal Air Force chief technician turned businessman has opened an RF testing facility in South Yorkshire. Ian White founded Gaddon, an RF engineering and test consultancy, 10 years ago, in that time it has carried out work for the Ministry of Defence (MOD). A new workshop at Hoyle Mill in Penistone near Barnsley will allow the firm to carry ...

Anritsu adds test upgrade for high speed LTE-Advanced mobiles

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Anritsu is supporting the testing of RF transceiver characteristics for 6CC CA with new software options for its MT8821C test system for LTE-Advanced/LTE-Advanced Pro terminals. The new software upgrade will support the implementation of faster LTE-Advanced/LTE-Advanced Pro network speeds: Carrier Aggregation (CA), which aggregates multiple component carriers (CCs). With support for RF and PHY layer measurements the test instrument’s capabilities ...

NIDays 2017 hears about University of Sheffield’s manufacturing research centre

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National Instruments is holding its annual NIDays London 2017 technology conference at Sandown Park Racecourse in Esher, on Tuesday 28th November. Focusing on NI’s software-defined systems in test, measurement and control, a stand-out this year will be a presentation from guest speaker Stuart Dawson, Chief Technology Officer at The University of Sheffield’s Advanced Manufacturing Research Centre (AMRC). Dawson will discuss ...