Embedded Systems

We caught up with WIN SOURCE in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. James Fu – Business Development Manager, North America, at WIN SOURCE – discusses the use of AI in the company’s growing role in the electronics supply chain… He covers, for example, global sourcing and catering for customised solutions, and ...

We caught up with Coilcraft in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Len Crane – Senior Technologist – discusses power inductors and how predicting performance gets better with Coilcraft MAGPro tools. He covers, for example, making inductors smaller and more compatible with surrounding components, making solutions better and smaller. Thank you to Len ...

We caught up with Siglent in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Thomas Rottach – Sales & Marketing Director of Siglent – discusses presenting the company’s new flagship oscilloscope, the SDS7000A, at the show. He covers, for example, its 4GHz frequency range and vertical resolution of 12 bits, enabling the company to ...

We caught up with F&S in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Holger Frölich – Managing Director of F&S – discusses the company’s new product family of direct solder modules based on the OSM standard. He covers, for example, the range of modules available and their possible applications, as well as the ...

We caught up with Analog Devices at Embedded World 2024 as part of our promotional coverage for the event. Fiona Treacy – Managing Director of Industrial Automation at Analog Devices – discusses creating energy-efficient production environments for a more sustainable future. She covers, for example, digitizing, connecting, and interpreting data from the factory floor in real-time and how this unlocks ...

We caught up with NXP in Nuremberg at Embedded World 2024 as part of our promotional coverage for the event. Brian Carlson – Global Marketing Director, Automotive Processors at NXP – discusses the company’s S32 CoreRide platform. He covers, for example, super-integration, and the combination of hardware and software and ecosystems necessary for software-defined vehicles (SDV). Thank you to Brian ...

We caught up with the Winbond team at Embedded World 2024 as part of our promotional coverage for the event. Jun Kawaguchi, Steam Lin and Tetsu Ho – discuss longevity for industrial memory, security for small form factor devices, their Fabs in Taiwan, and Winbond OctalNAND Flash… Jun Kawaguchi covers, for example, the company’s W77Q, a security flash memory with ...

  Concurrent Technologies has put Intel Atom x7000RE Amston Lake processors into a VME board, adding image processing and AI audio processing accelerators to the venerable form factor. CPU choice on the board, called Rhea, is either the four-core 1.5GHz x7433RE, or the two-core 2GHz x7213RE. “Whilst no longer the cutting edge of technology, VME continues to be a widely ...

A roundup of all the latest electronics news from Embedded World in Nuremberg.

Congatec announced SMARC modules based on Intel’s Atom x7000RE ‘Amston Lake’ processors. “Specially designed for industrial requirements, they deliver eight processor cores, double the previous generation, while maintaining the same power consumption,” according  to Congatec. Called conga‑SA8, the modules are credit card size and operate over -40 to +85°C. Read all the latest news from Embedded World 2024 » AI ...