Home » Tag Archives: Embedded World (page 10)

Tag Archives: Embedded World

COM-HPC specification makes progress

COM-Express-module-connector-side-300x200.jpg

Caroline Hayes finds out the progress being made for the latest high-speed embedded computing standard, COM-HPC As the industry prepares for the computing demands of increased connectivity in vehicles, factories and homes, the PCI Industrial Computer Manufacturers Group (PICMG) is able to provide an update on the standard computer on module (COM) standard that will provide the scalable performance and ...

Oscilloscope enhancements and new analyser

RIGOL_PR-1976_Embedded-World_02-300x200.jpg

Embedded World 2020: Among the established products on display, Rigol Technologies will be highlighting additions to its oscilloscope portfolio and a new real-time spectrum analyser at the show in Nuremberg (25-28 February). The MSO8000 digital oscilloscope has been added to the company’s UltraVision II range which is characterised by its Phoenix chipset architecture and with two asics developed in-house. Bandwidths ...

Embedded World: Video Interview – AY Electronics Group expanding into European market

AY-Electronics-Group.jpg

At Embedded World 2019, we caught up with Asaf Mirvis of AY Electronics Group as part of our promotional coverage for the event. He discusses discusses the strengths of being a supply chain management specialist, and how the group has major plans to expand into European market, with a German office in Frankfurt. Thank you to Asaf for his time. ...

Embedded World: Video Interview – Chris Ard on recruiting and keeping young engineers

Chris-Ard-300x200.jpg

At Embedded World 2019, we caught up with Chris Ard, Managing Director & Director of Business Development at TouchNetix. It’s time to eliminate that British thinking that “Engineers have dirty hands” he says, in a wide-ranging interview. He also talks of IoT development being in early stages and the difficulties of recruiting and keeping young engineers. Thank you to Chris ...

Embedded World: Video Interview – Randall Restle on a great time to be an electronics engineer

Randall-Restle-2-300x200.jpg

At Embedded World 2019, we caught up with Randall Restle, Vice President of Applications Engineering at Digi-Key. He shares his enthusiasm for electronics and the continuous innovation within the industry, touching on the role of German culture in the valuing of engineering as a discipline. It’s wonderful time to be an engineer, he says! Thank you to Randall for his ...

Video: Embedded World 2019, the overview

Embedded-World-exterior-2019-300x200.jpg

Here is our video overview of the Embedded World 2019 show in Nuremberg, capturing views and voices from down on the busy show floor. The range of products and engineering focus are very evident – engineers doing the hard work to simplify the delivery of solutions. As always, special thanks to our video specialist David Berman. Read all our Embedded ...

Embedded World: Video Interview – Power Integrations on brushless DC motors and BridgeSwitch

EW19-Power-Integrations-300x200.jpg

At Embedded World 2019, we caught up with Christian Ionescu-Catrina of Power Integrations as part of our promotional coverage for the event. He discusses how brushless DC motors are more efficient and more compact and how Power Integrations’ BridgeSwitch won the Most Innovative Product award at the Embedded World show. It has three aims, he says: remove the heatsink, increase ...

Embedded World: Video Interview – Maxim offers turnkey solutions for embedded security

EW19-Maxim-300x200.jpg

At Embedded World 2019, we caught up with Christophe Tremlet of Maxim Integrated as part of our promotional coverage for the event. He discusses how IoT and industry 4.0 will simply not happen without security, and hardware-based security provides the ultimate level of protection for assets. Thank you to Christophe for his time. Read all our Embedded World 2019 coverage » ...

Embedded World: Video Interview – Cypress on low-power, intelligent platforms for IoT

EW19-Cypress-300x200.jpg

At Embedded World 2019, we caught up with Brian Bedrosian of Cypress Semiconductor as part of our promotional coverage for the event. He discusses Cypress integrating processing, wireless and cloud connectivity into a platform for development, which enables designers to concentrate on their application-specific areas. Thank you to Brian for his time. Read all our Embedded World 2019 coverage » ...