The Siemens EDA Automotive Technology Day takes place on 24 September 2024 at the Audi Conference centre at Munich Airport.

With the title of “Empowering Semiconductor development for the Software Defined Vehicles revolution”, the Automotive Tech Day is a one-day in-person, event for engineers focused on Safety, security, testing and verification of automotive semiconductors.

See event-new.sw.siemens.com/website/77410/

Keynote Speakers include Laith Altimime (President Semi Europe) and Lee Harrison (Director, Product Marketing Tessent Siemens).

Topics of content include: Zero Defect manufacturing Testing, Reliability, 3DIC, Safety addressing random HW failures, Accelerating DV with AI/ML, and Avery Verification IP.

Speakers

Laith Altimime – President Semi Europe
As President of SEMI Europe, Laith Altimime leads SEMI’s activities in Europe and Middle East and North Africa (MENA). He has overall responsibility for regional events, programs, membership, advocacy, and collaborative forums. Additionally, he manages and nurtures relationships with SEMI members in the region, as well as with local associations and constituents in industry, government, and academia. He provides support and services to SEMI members worldwide that have supply chain interests in Europe.
Altimime has more than 25 years of experience in the industry, mostly in Europe. He has held leadership positions at Altis, Infineon, Qimonda, KLA-Tencor, Communicant Semiconductor AG, NEC Semiconductors, and imec. Altimime holds a BS from Heriot-Watt University, Scotland.

Lee Harrison– Director, Product Marketing Tessent Siemens
Lee Harrison is Director, Product Marketing, with Siemens Tessent Division. He has over 20 years of industry experience with Siemens Tessent DFT products and has been involved in the specification of new test features and methodologies for Siemens customers, delivering high quality DFT solutions. With a focus on safety and security, Lee is working to ensure that current and future DFT requirements of Siemens’s Automotive customers are understood and met. Lee Received his BEng in MicroElectronic Engineering from Brunel University London in 1996. Lee presents regularly at industry conferences such as DAC, ITC, VTS, ETS, DATE etc.

Lear more here.