Electronics Weekly Electronics Design & Components Tech News
The size of smartphones and IoT devices continues to decrease – requiring smaller components. To accurately amplify small signals as needed in high precision sensing, op amps must improve low input offset voltage and noise performance while continuing to shrink the form factor.
The TLR377GYZ succeeds in balancing miniaturization with high accuracy (which has been difficult to achieve with conventional op amps) by further evolving proprietary circuit design, process, and packaging technologies cultivated over many years.
Op amps’ input offset voltage and noise generation degrade amplification accuracy and can be suppressed by increasing the size of the built-in transistors – but at the expense of miniaturization. In response, ROHM developed proprietary circuits which achieve a maximum offset voltage as low as 1mV without increasing the size of the transistors.
In addition, proprietary process technology greatly reduce flicker noise, while ultra-low noise is achieved with an input equivalent noise voltage density of 12nV/√Hz by optimizing the resistive components at the element level. Furthermore, the new product adopts a WLCSP (Wafer Level Chip Scale Package) with a ball pitch of just 0.3mm utilizing original packaging technology.
This reduces size by approximately 69% compared to conventional products and 46% over existing compact products.
The IC-mounted conversion board that can replace SSOP6 packages is also offered to support replacement considerations and initial evaluation. Both the new product and conversion board are available for purchase through online distributors.
In addition, the high accuracy SPICE model – called ROHM Real Model – is available on ROHM’s website for verification simulations.
