RF & Microwave

With Matter communication in mind, Murata has combined Wi-Fi 6, Bluetooth and IEEE 802.15.4 LR-WPAN radios in a single module – LBES5PL2EL, which it described in detail at Embedded World in Nuremberg today. “There are still only a few Matter-compliant solutions on the market, yet the potential for it to deliver convenience and comfort to the places in which we ...

Infineon has created an IC to embedded in things that need to be controlled by a near-by mobile phone, which has in-built sensing and a motor driver. “Potential applications range from medical patches and disposable point-of-case testers, to data loggers, smart thermostats, smart locks and sensor inlays,” according to the company. Called NGC1081, the IC can be temporarily powered by ...

Murata has created a 1210 (3.2 x 2.5 x 2.5mm) wide-band wire-wound chip common mode choke that will attenuate noise on 1.2A automotive supply rails at over 1GHz. “It is of particular value when addressing the power supply line noise issues now occurring as driver assistance hardware connects with wide frequency band sensors and imaging equipment such as radar and ...

STMicroelectronics has created a 40nm Bluetooth LE 5.3 wireless microcontroller family centred around a 100MHz Arm Cortex-M33 core – that’s the security-enabled version of the Cortex-M3, which has TrustZone virtualisation. Called STM32WBA52, the ICs are similar to the company’s earlier Cortex-M4-based STM32WB wireless microcontrollers, and have a +10dBm 2Mbit/s 2.4GHz transceiver (10.6mA at 0dBm TX, 7.4mA Rx) that can support ...

Lemo has put a dozen 26.5GHz coax contacts inside a high-reliability circular connector housing, sealed to IP68 when mated. Called LM.232, its signal paths are 50Ω, with a VSWR of ~1.2 from 5 to 15GHz, peaking to 1.4 at 18GHz. The contacts are designed to be terminated on LMR-100A, Multiflex 86, RG-174/U, RG-188 A/U or RG-316/U flexible cables. Attachment is ...

The fundamentals of next-generation wireless communications are in progress and commercial deployment is expected around 2030. This will enable new possibilities, including holographic applications, extended realities and digital twins, says Dr Taro Eichler. The prospect of offering large contiguous frequency bands to meet demand for extremely high data transfer rates in the Tbit/s range will drive the next generation of ...

MWC makes a welcome return as an in-person event later this month. This preview highlights some of the announcements expected at a varied exhibition and conference that covers automotive to satellites, writes Caroline Hayes. MWC is renowned for networking opportunities and collaboration. Two partners that will showcase their collaborative efforts are Picocom and Antevia Networks. They are working together to ...

STMicroelectronics has released nine chip-scale passive RF balun ICs that include antenna impedance-matching and harmonic filtering for its STM32WL sub0GHz wireless microcontrollers. Intended to sit in Rx and TX paths between the MCUs and their antennas, the 8bump parts are in 2.13 x 1.83mm packages with a maximum height of 630µm after reflow. Applications are foreseen in LoRaWAN, Sigfox, M-Bus ...

MediaTek has announced some details of its Dimensity 7200 phone SoC. To be built on a 4nm process from TSMC, it will have eight Arm cores: two 2.8GHz Cortex-A715 cores and six Cortex-A510, then MediaTek’s own AI processing pnit (APU) and an Arm Mali G610 GPU. Memory runs at 6.4Gbit/s and there is UFS 3.1 for storage. For gamers, there ...

The Bluetooth Special Interest Group (SIG) has released a new wireless standard for the electronic shelf label (ESL) market – Bluetooth ESL – which it describes as scalable, ultra-low power and highly secure. Designed to replace proprietary wireless protocols, it is based on Bluetooth technology and was created with companies involved in the market, such as such as SES-imagotag and ...