A jv between TSMC, Bosch, Infineon and NXP, the decline of the RAN market, AMD buying a server manufacturer, the value of the automotive semiconductor market, and the new lower-cost Raspberry Pi 5 model...
Tag Archives: AMD
What caught your eye this week? (Micro fan, AMD, Stretchy sensor, RPA)
We're talking cooling fans the size of a finger nail, AMD buying a server manufacturer, researchers creating a simple stretchy sensor, and GEO satellites supporting remotely piloted aircraft...
Five reasons to consider a SOM vs a chip-down design
The growing interest in exploring modular hardware instead of a traditional chip-down approach requires an understanding of the pros and cons of each approach, say James Jaksich and Camron Chilton. There are five key benefits of a system-on-module (som) approach, which will help engineers through the make vs buy decision process. Flexibility Standards defining size, connectors and interfaces play a ...
AMD to match Nvidia’s one year cadence for AI IC introductions
Earlier today, AMD CEO Lisa Su said AMD would match the one year cadence for new AI processors set yesterday by Jensen Huang, CEO of Nvidia. AMD’s next AI chip – the MI325X – will ship in Q4, said Su. Its successor, the MI350, will ship in 2025 and the successor to the MI350 – the MI400 – will ship ...
JESD239 standard to improve GDDR7 memory performance in AI, Gaming
JEDEC has published a GDDR7 Graphics Memory Standard, JESD239, to improve memory performance in applications such as AI, graphics, gaming. Specifically, the standards body has announced the publication of JESD239 Graphics Double Data Rate (GDDR7) SGRAM. Described as a groundbreaking new memory standard, JESD239 GDDR7 offers double the bandwidth over GDDR6, reaching up to 192 GB/s per device. JEDEC highlights ...
Most Read articles – Chip sales, Spartan UltraScale+, Peak smartphone
There's recent semiconductor sales, smartphone shipment levels, the Spring Budget, US aims to be manufacturing 20% of the world’s most advanced logic chips, and AMD releasing its Spartan UltraScale+ FPGA family...
Imec honours AMD CEO for technology development and industry leadership
World-renowned semiconductor research lab Imec has named Lisa Su, chair and CEO of AMD, as the winner of the 2024 Imec Innovation Award. “Since taking the helm of AMD in 2014, Dr Su’s technological acumen and leadership have propelled the company to the forefront of semiconductor technology development,” said Imec CEO Luc Van den hove. “Under her leadership, AMD has ...
Computex 2024
Taipei’s long-established exhibition, Computex has evolved with the industry and this year will continue with the theme of “connecting AI”, featuring the latest tech trends: AI Computing, Advanced Connectivity, Future Mobility, Immersive Reality, Sustainability, and Innovations. There is a theme of AI throughout this year’s event, including an opening keynote to be given by AMD Chair and CEO Dr Lisa ...
FPGA motor drive starter kit for system-on-module
AMD has introduced a motor driver starter kit for its Kria K24 system-on-module – which is built around a Zynq UltraScale+ IC and measures 60 x 42 x 11mm. The kit, called KD240 drives starter kit, includes the module, a carrier card and a heat sink. Included is 2Gbyte (2chan x 256Mbit x 16bit/chan) of LPDDR4, and a 512Mbit QSPI ...
AMD’s high-end industrial embedded CPUs with integrated graphics
AMD is aiming at industrial automation with its latest embedded processor series, as well as machine vision, robotics and edge servers. The series has on-board graphics and “because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11”, according to ...