TI breaks ground on Utah fab

TI  has broken ground on a 300-mm fab in Lehi, Utah.

Joined by Utah Governor Spencer Cox, TI CEO Haviv Ilan took the first steps toward construction of LFAB2 which will connect to the company’s existing 300-mm wafer fab in Lehi.

“Today we take an important step in our company’s journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” said Ilan.

In February, TI announced its $11 billion investment in Utah, marking the largest economic investment in state history. LFAB2 will create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production in 2026.