3-D imaging makes an impact on PCB optical inspection

Goepel Electronic will use next month’s Electronica exhibition in Munich to present a 2D/3D camera module for optically inspecting PCBs and ball grid-array chip packages.

3-D imaging is now making its impact on automated optical inspection (AOI) and the key feature, says Goepel, is providing shadow-free 3D measurement.

What it has done with the 3D·ViewZ module is to combine 2D image acquisition technology and 3D measurement techniques.

Orthogonal, telecentric image recording works together with four angled-view cameras and four fringe projectors for measurement of components and solder joints.

All inspection technologies use one field of view (FOV) without additional axis movement.

The integrated rotary drive also allows up to 360 projection directions for the 3D image acquisition. This makes for a faster image acquisition and measurement speed which is important for production testing of PCBs.