Anything which can get you through an airport quicker these days is to be much welcomed and CEA-Leti has developed an X-ray-diffraction module for airport baggage-scanning which can speed up the process of identifying the materials contained in the contents of a luggage bsg. The module analyses x-ray diffraction signals at small angles measured by innovative spectrometric detectors to identify ...
A European pilot line for digital, analogue and RF ICs on 10nm and 7nm FD-SOI was announced today at French research lab CEA-Leti in Grenoble. Called Fames Pilot Line, it will create manufacturing processes for OxRAM, FeRAM, MRAM and FeFETs embedded non-volatile memories; RF switches, filters and capacitors; integrated inductors for dc-dc converters; and both heterogeneous and sequential 3D integration. ...
We're talking thin and light PCs, Arm's Windows PC market share, wafer bonding by CEA-Leti, and lunar night survival technology...
French research lab CEA-Leti has reported stacking three 300mm wafers for improved CMOS image sensors, using hybrid wafer bonding and high-density through-silicon vias. The announcement was made in three papers at ECTC, the 2024 IEEE Electronic Components and Technology Conference in Colorado. 6μm hybrid bonding pad pitch, and TSVs are 1 x 10μm It is working towards a new generation ...
Despite there potential efficiency, piezoelectric power converters are a technology that has never become popular, even though the power transfer component is thin and flat, instead of boxy like an inductor, and piezoelectrics are quick and simple to make – much like a ceramic capacitor. The flip-side are the disadvantages, warranting a mushrooming component count to temper them. Enter the ...
French laboratory CEA-Leti looking to find ways to improve road safety through automated vehicle-to-vehicle communication. Its initiative is intended to “contribute to a higher level of vehicle automation and cooperation by expanding the latest developments in vehicular wireless communications that improve reaction time, pedestrian detection and overall vehicle performance”, according to Leti. By “combining learnings from participation in three EU ...
Intel is to team up with French lab CEA-Leti to put two-dimensional transition-metal dichalcogenides on 300mm wafers. The aim of the multi-year project is to develop a way to transfer layers of 2d material, grown on substrates up to 300mm, to a second substrate for transistor building. Intel will supply manufacturing expertise and CEA-Leti has bonding, layer-transfer and characterisation knowledge. ...
Astronode S is an RF module from satellite operator Astrocast, intended to be built into land or sea-based battery-powered IoT devices. It is based on an architecture developed by French research lab CEA-Leti, and an IC co-developed with Astrocast to optimise its link budget and power consumption to suit a particular Astrocast’s ground-to-satellite protocol – which offers a variable user ...
French research lab CAE-Leti has developed a sonic event-driven object-localisation system using analogue in-memory neuromorphic computation, inspired by a barn owl’s brain. “Real-world sensory-processing applications require compact, low-latency, and low-power computing systems,” according to CEA-Leti. “Enabled by their in-memory, event-driven computing abilities, hybrid memristive-CMOS neuromorphic architectures provide an ideal hardware substrate for such tasks.” In the owl, the difference between arrival ...
Intel and CEA-Leti have optimised a hybrid direct-bonding, self-assembly process for D2W (Die-to-Wafer) bonding that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. While the D2W hybrid bonding process is seen as being ...
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