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Tag Archives: image sensor

SmallSat 2024: Hyperspectral imager

Imec hyperspectral sensor

At the Small Satellite Conference in Utah, Imec announced a hyperspectral sensor with an on-chip line-based filter covering 450 – 900nm in 96 bands. It had equidistantly divided spectral bands and, compared with its previous generation, double the TDI (time-delayed-integration) capacity – to 10 line per band. Underneath the filter is a ‘2/3inch’ 2,048pixel image sensor from AMS – the ...

1,280×1,024 10µm-pitch read-out IC for infra-red imagers

Bruised apple imaged with Senseeker focal plane array

Senseeker has introduced a 1,280 x 1,024 version of its 10µm digital read-out IC (‘droic’) for short-wave infra-red imaging arrays, including quantum dot-based detector types. RD0131 as it will be known has a capacitive transimpedance amplifier (CTIA) front-end. There are three selectable gains, with well capacity of: 22k electrons (high-gain), 160ke- (medium) or 1.1Me- (low). In high gain, room temperature ...

X-ray image sensor with 1,272 x 1,104 pixels

Hamamatsu flat panel xray sensor

Hamamatsu Photonics has created an x-ray image sensor for real-time non-destructive testing and digital radiography. C16401SK-51 has 1,272 x 1,104 pixels, a photo-sensitive area of 140 x 122.8mm, and uses cmos sensing with a GOS (gadolinium oxysulfide) scintillator. “This combination ensures optimal performance and reliability, even when used with x-ray tube voltages of up to 160kV, making it suitable for ...

ECTC: Triple wafer stacking for image sensors with embedded AI

Leti wafer stack for AI image sensor

French research lab CEA-Leti has reported stacking three 300mm wafers for improved CMOS image sensors, using hybrid wafer bonding and high-density through-silicon vias. The announcement was made in three papers at ECTC, the 2024 IEEE Electronic Components and Technology Conference in Colorado. 6μm hybrid bonding pad pitch, and TSVs are 1 x 10μm It is working towards a new generation ...

Adhesive bonds glass to die for image sensors

Delo image sensor adhesive CMOS BGA with glass

Delo has created a sealant adhesive for bonding glass filters directly on to cmos image sensor die. “EG6290 can be dispensed in narrow high bond-lines, can compensate for temperature-dependent pressure changes, and meets routine automotive standards,” according to the company, which clarified that it “fulfills the requirements of the AEC-Q100 Grade 2 automotive industry standard”. Young’s modulus is 2,350MPa and ...

Industrial colour and mono cameras with Sony IMX662 sensor

IDS ueye-xcp-superspeed-usb- camera

Imaging Development Systems (IDS) is offering Sony’s IMX662 1/2.45 inch 2.16 Mpixel sensor in both colour and monochrome cameras. U3-38C0XCP comes in a completely closed 29 x 29 x 17mm zinc die-cast housing with an integral C-mount lens holder. “The sensors belonging to Sony’s Starvis 2 series are designed for maximum light sensitivity,” according to IDS. “We offer this rolling ...

ST makes giant image sensor for Las Vegas attraction

BigSky camera credit SphereEntertainment

STMicroelectronics has made a custom 316Mpixel 18K image sensor for a company with a super-high resolution cinema in Las Vegas. The die measures 99 x 83mm (82.4cm2) – four fit onto a 300mm wafer (right). It can capture images at 120frame/s and transfer data at 60Gbyte/s. “Building a custom sensor of this size, resolution and speed, with low noise, high ...

5K industrial camera is 29 x 29 x 17mm

ids-uEye-xcp_industrial-camera

IDS has adopted Onsemi’s 20Mpixel AR2020 image sensor for an industrial camera called uEye+ XCP. It has 5,136 x 3,856 pixels, a USB3 interface and a closed housing measuring 29 x 29 x 17mm that includes a mechanical interface for C-mount lenses. “With the rolling shutter sensor AR2020 [is] the technical successor of the Onsemi AR1820,” said IDS. “With 20Mpixel, ...

A fiery end to Aeolus, and its Chelmsford-made image sensor

ESA Aeolus Teledyne

ESA has begun the controlled destruction of its Aeolus global wind-measuring satellite. Launched in 2018, the 1.3 tonne satellite has already worked 18 months longer than its planned three year mission, but is now running out of orbit-maintaining fuel. Matter and radiation released by recent solar flares and coronal mass ejections have temporarily increased drag in space, and ESA is ...