A European pilot line for digital, analogue and RF ICs on 10nm and 7nm FD-SOI was announced today at French research lab CEA-Leti in Grenoble. Called Fames Pilot Line, it will create manufacturing processes for OxRAM, FeRAM, MRAM and FeFETs embedded non-volatile memories; RF switches, filters and capacitors; integrated inductors for dc-dc converters; and both heterogeneous and sequential 3D integration. ...
French research lab CEA-Leti has reported stacking three 300mm wafers for improved CMOS image sensors, using hybrid wafer bonding and high-density through-silicon vias. The announcement was made in three papers at ECTC, the 2024 IEEE Electronic Components and Technology Conference in Colorado. 6μm hybrid bonding pad pitch, and TSVs are 1 x 10μm It is working towards a new generation ...
Intel is to team up with French lab CEA-Leti to put two-dimensional transition-metal dichalcogenides on 300mm wafers. The aim of the multi-year project is to develop a way to transfer layers of 2d material, grown on substrates up to 300mm, to a second substrate for transistor building. Intel will supply manufacturing expertise and CEA-Leti has bonding, layer-transfer and characterisation knowledge. ...
French research lab CAE-Leti has developed a sonic event-driven object-localisation system using analogue in-memory neuromorphic computation, inspired by a barn owl’s brain. “Real-world sensory-processing applications require compact, low-latency, and low-power computing systems,” according to CEA-Leti. “Enabled by their in-memory, event-driven computing abilities, hybrid memristive-CMOS neuromorphic architectures provide an ideal hardware substrate for such tasks.” In the owl, the difference between arrival ...
Scientists in France have demonstrated a lens-less infra-red spectral-imaging system for medical diagnostics, obtaining simultaneously morphological and biochemical information. Images at different wavelengths differentiate tumour cells “The combination of a set of lasers and lens-less imaging with an uncooled bolometer matrix allows biochemical mapping over a wide field of view,” said Grégoire Mathieu of Grenoble research institute CEA-Leti. “The project ...
A European consortium has been launched to lay the foundations for quantum processor manufacture on an industrial scale in the EU. Called Quantum Large-Scale Integration with Silicon (QLSI), and valued at €15m, it will focus on spin qubits and silicon lithography as the route to maintaining large numbers of quantum bits for information processing. “The partners have already realised many ...
Last week it was reported that a tetraplegic man was able to walk and control both arms using a direct brain interface – a neuroprosthetic that read, transmitted and decoded brain signals in real-time to control an exoskeleton. The brain connection is through a ‘semi-invasive’ medical device called Wimagine, developed at French lab CEA – specifically its Clinatec laboratory in ...
French semiconductor research lab Leti is to present 11 papers at the IEEE International Electron Devices Meeting (IEDM) next month, which is being held in San Francisco – including one invited paper on scalable silicon quantum computing. CEA-Leti’s sessions at IEDM include: Monday 03 December 7.2: Breakthroughs in 3D sequential technology 2:00pmContinental Ballroom 6 6.2: Towards scalable silicon quantum computing ...
French research lab Leti has teamed up with low-volume chip firm CMP to provide 200mm multi-project wafers (MPWs) including non-volatile memory OxRAM (Oxide-based Resistive Memory). “Leti’s integrated silicon memory platform is developed for backend memories and non-volatility associated with embedded designs,” said the lab. “The technology platform will be based on titanium-doped hafnium oxide [HfO2/Ti] active layers.” The OxRAM is ...
Leti says field trials of its LPWA technology demonstrate significant performance gains in coverage
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