Comments on: ECTC: Triple wafer stacking for image sensors with embedded AI https://www.electronicsweekly.com/news/research-news/triple-wafer-stacking-for-image-sensors-with-embedded-ai-2024-05/ Electronics Design & Components Tech News Mon, 03 Jun 2024 22:01:07 +0000 hourly 1 https://wordpress.org/?v=6.2.2 https://www.electronicsweekly.com/wp-content/themes/ew/images/logo.gif Electronics Weekly https://www.electronicsweekly.com/news/research-news/triple-wafer-stacking-for-image-sensors-with-embedded-ai-2024-05/ 125 75 Electronics Design & Components Tech News By: Mike Archbold https://www.electronicsweekly.com/news/research-news/triple-wafer-stacking-for-image-sensors-with-embedded-ai-2024-05/#comment-1515902 Mon, 03 Jun 2024 22:01:07 +0000 https://www.electronicsweekly.com/?p=842176#comment-1515902 Use of “understanding” is problematic. See link https://drive.google.com/file/d/1xYN7HkBNi1w6SsAt54OFkgPBQqTwVjx2/view?usp=drive_link

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