IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips

Ceva has introduced a multi-radio intellectual property package for IoT IC designers that combines Wi-Fi 6, Bluetooth 5.4 and 802.15.4 modems with a 2.4GHz transceiver aimed at TSMC’s 22nm process.

Called Links100 (diagram right), it is the first of a series of IP products (diagram below) that will also include transceivers for Wi-Fi 7 with MLO (multi-link operation), and UWB (ultra wide-band) with FiRa 2.0, CCC Digital Key 3.0 and radar.

“The demand for smaller devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip,” according to the company.

Wi-Fi 6 in Links100 is a 1×1 40MHz transceiver, and the Bluetooth 5.4 is dual-mode, supporting Classic Audio and LE Audio with Auracast, “and available with a suite of Bluetooth profiles”, said Ceva.

Later products will have Wi-Fi 7 and UWB

IEEE 802.15.4 tranception is provided to implement Thread, Matter and ZigBee, and a co-existence hardware is available to improve concurrent operation of the three transceivers through the single RF path.

Deliverables for the IP series include RTL and C code packages for each wireless protocol – packages which can include sensing and location algorithms for Bluetooth Channel Sounding, Wi-Fi CSI, and UWB radar.