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Tag Archives: chiplet

US puts up $1.6bn for packaging R&D

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The U.S. Department of Commerce is to put up $1.6 billion to fund R&D to accelerate domestic capacity for semiconductor advanced packaging. The programme will focus on five areas: Equipment, tools, processes, and process integration; Power delivery and thermal management; Connector technology, including photonics and radio frequency (RF); Chiplets ecosystem; Co-design/EDA. Several awards of approximately $150 million per award in ...

YorChip predicts 2026 will be the year of the chiplet

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Nearly a year after announcing its strategic partnership with FPGA developer QuickLogic to produce FPGA chiplets, YorChip elaborated on its plans to apply chiplets to more general-purpose applications. Start-up YorChip specialises in UCIe-compatible IP. Last August the company announced a partnership with FPGA provider QuickLogic to collaborate in developing FPGA chiplets optimised for low power consumption and low cost. The ...

Chiplet Summit: Alphawave tapes out UCIe multi-interface chiplet

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On TSMC’s 7nm process, Alphawave Semi has taped-out an IO chiplet covering UCIe (universal chiplet interconnect express – rev1.1) Ethernet, PCIe and CXL, claiming it to be industry’s first. “Delivering a total bandwidth of up to 1.6Tbit/s, the enables up to 16 lanes of multi-standard PHY supporting PCIe 6.0, CXL 3.x and 800G Ethernet in a combination of mixed operating ...