Our most popular stories on the site cover an AI startup, ev sales, Amkor getting US Chips Act funding, Meta canceling its headset, and Imec sharing some thoughts on the chiplet phenomenon...
Tag Archives: chiplet
US puts up $1.6bn for packaging R&D
The U.S. Department of Commerce is to put up $1.6 billion to fund R&D to accelerate domestic capacity for semiconductor advanced packaging. The programme will focus on five areas: Equipment, tools, processes, and process integration; Power delivery and thermal management; Connector technology, including photonics and radio frequency (RF); Chiplets ecosystem; Co-design/EDA. Several awards of approximately $150 million per award in ...
What caught your eye this week? (Chiplets, Dyson, Lunar landscape)
We're talking 2026 as the year of the chiplet, Dyson laying off staff n the UK, and a Lunar Surface Proving Ground... The Electronics Weekly team share some fingerposts.
YorChip predicts 2026 will be the year of the chiplet
Nearly a year after announcing its strategic partnership with FPGA developer QuickLogic to produce FPGA chiplets, YorChip elaborated on its plans to apply chiplets to more general-purpose applications. Start-up YorChip specialises in UCIe-compatible IP. Last August the company announced a partnership with FPGA provider QuickLogic to collaborate in developing FPGA chiplets optimised for low power consumption and low cost. The ...
Chiplet Summit: Alphawave tapes out UCIe multi-interface chiplet
On TSMC’s 7nm process, Alphawave Semi has taped-out an IO chiplet covering UCIe (universal chiplet interconnect express – rev1.1) Ethernet, PCIe and CXL, claiming it to be industry’s first. “Delivering a total bandwidth of up to 1.6Tbit/s, the enables up to 16 lanes of multi-standard PHY supporting PCIe 6.0, CXL 3.x and 800G Ethernet in a combination of mixed operating ...