Solderable 45x45mm i.MX 8M Plus OSM LGA module

In OSM, SGeT defines a module to be soldered on the carrier board as an LGA package, rather than using edge or board to board connectors.

Called iW-RainboW-G40M, this module is Size-L (45 x 45mm), with provision for 662 contacts.

It is “28% smaller than the µQseven [40 x 70mm], a standard also hosted by SGeT, and 51% smaller than SMARC [82mm x 50mm]”, according to IWave. “iW-RainboW-G40M integrates the powerful i.MX 8M Plus processor in the compact OSM 1.0 standard, delivering AI and machine learning capabilities on a compact edge device.”

The company list two image signal processors and a dedicated neural network processor at up to 2.3Top/s.

It has provision for CAN-FD and time-sensitive networking amongst its interfaces.

Software drivers and board support packages are available for Ubuntu, Android and Linux, it said.

Applications are foreseen in smart homes, smart cities and industrial IoT.

• i.MX 8M Plus dual/quad/quad lite
• 2Gbyte LPDDR4 (pp to 8Gbyte)
• 16Gbyte eMMC (up to 64Gbyte)
• 802.11 b/g/n/ac/ax Wi-Fi (ax is an option)
• Bluetooth 5.0
• 2x CAN-FD ports
• 2x RGMII Interfaces
• PCIe 3.0
• 2x LVDS

Established in 1999, iWave Systems Technologies is based in Bangalore. It is a gold member of the NXP Partner Program.