xMems’ monolithic cooling ‘fan’ is the size of a finger nail

XMC-2400, as it will be known, measures 9.26 x 7.6 x 1.08mm.

Designed to have one of its flat sides in contact with the object to be cooled, it draws in air through holes in its other flat side, and discharges it through one of the edges.

“A single XMC-2400 can move up to 39cm³/s with 1,000Pa of back pressure,” according to the company, claiming: “The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.”

It envisages the coolers being used inside mobile phones, and will get samples to potential customers in Q1 next year 2025.

Selected companies will see it demonstrated before then, at September’ xMems Live events in Shenzhen and Taipei.