Tag Archives: JEDEC

The JEDEC Solid State Technology Association has published its JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, supporting the memory module configurations known as “raw cards” (JESD401-5B). This is consistent, says the standards body, with the recently updated contents of JESD401-5B DDR5 DIMM Label and JESD318 DDR5/LPDDR5 Compression Attached Memory Module (CAMM2) Common Standard. JESD406-5 The new publication documents the ...

JEDEC has unveiled its plans for advanced memory modules to enable future high-performance computing and AI applications. Specifically, the standards body has revealed details about its standards for DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6. The aim is to provide “unparalleled bandwidth and memory capacity”. Both projects are in development ...

JEDEC has published “JESD405-1B JEDEC Memory Module Label – for Compute Express Link (CXL) V1.1”, providing detailed guidelines for CXL memory modules. These modules are described as “end-user friendly hot pluggable assemblies” and are for data centres and similar server applications. They conform to SNIA (Storage Networking Industry Association) EDSFF form factors E1.S and E3.S. CXL Specifically, JESD405-1B defines the ...

JEDEC has published a new release of the JEP30 Part Model Guidelines, including reference documents and related XML Schema files. Working in collaboration with the Open Compute Project Foundation (OCP), the electronics standards body says it has combined the capabilities and open standards of OCP’s Chiplet Data Extensible Markup Language (CDXML) into its JEP30 Guidelines. In prospect, it suggests, is ...

Historically, component temperature has been correlated with reliability, with early studies relating field failure rates to steady-state component temperature. More recently, physics-based reliability prediction has related failure rates of electronic assemblies to the magnitude of temperature change over an operational cycle (power-on, power-off, power-on…) and rate of temperature change, both of which are influenced by steady-state operating temperature. Electronics failures ...

Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...

JEP181 from JEDEC is a neutral file XML-based standard for thermal models. The chosen file format is ECXML, for ‘electronics cooling extensible mark-up language’. “A de facto standard for a number of years, ECXML is now published by JEDEC as the JEP181 guideline,” according to Siemens, which participated in the creation of the standard. “The standard was created to meet a ...

 Vishay has developed high-speed high-power IR LEDs for gesture remote control. The 940nm devices emit 40mW/sr of radiant power with 100mA drive over +/-18° vertical and +/-36° horizontal (to half intensity. “The device’s unique angular distribution makes it ideal for gesture remote control of televisions and gaming systems, where it provides excellent spectral matching with silicon photodetectors,” said the firm. ...

Toshiba has demonstration a system supporting version 1.1 of the JEDEC Universal Flash Storage (UFS) standard, claiming it to be a world first. UFS is a specification for embedded flash storage in mobile devices such as phones and tablets. “It represents an evolutionary progression of JEDEC standards in this field, and has been specifically tailored for mobile applications and computing ...