EDA company, Mentor, has joined Nano 2022, the latest project to promote the French electronics manufacturing industry. It covers components, connectors and PCBs, to design and assembly, distribution, embedded software and software tools. The project is part of the European Commission’s Important Project of Common European Interest (IPCEI) to promote research and innovation in power ICs, sensors, optical equipment and ...
Process R&D
Fraunhofer shows flexible OLED printing breakthrough
New inks for inkjet printers make it possible to print organic displays or solar cells on film and glass for the use in architecture, the textile industry and many other industries, according to the Fraunhofer Institute for Applied Polymer Research IAP. At Printed Electronics Europe in Berlin this week, Fraunhofer IAP demonstrated how inks can be printed on solid substrates ...
Leti writes ‘unbreakable’ security code on to the chip
Leti, the French microelectronics research centre, says it has developed a way to encrypt individual chips with a security code. Working with lithography equipment supplier Mapper Lithography, Leti says it has perfected a way to generate a non-falsifiable code using a new chip design that leverages direct multi-beam writing in a process that fits in a conventional CMOS flow with ...
Graphene balls climb the ladder to battery success
Continuing the industry’s love affair with lithium for batteries, researchers have found a way to avoid dendrites which grow on as the battery charges and discharges and which can degrade performance. Building on work began by Jiaxing Huang, professor of materials science and engineering at Northwestern University’s McCormick School of Engineering, Jiayan Luo, professor of chemical engineering at Tianjin University ...
CMOS will cut cost of integrated photonics, says Leti
French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. “This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology that requires contacts with noble ...
Glasgow University works with local firms on single photon detectors
CST Global, the Glasgow-based III-V opto-electronic, semiconductor foundry, is collaborating with the University of Glasgow and Gas Sensing Solutions on a project to fabricate active matrix, single-photon GaAs devices. The project will develop light-weight, monolithic, mid-wave infrared (MWIR) imagers, capable of detecting a single photon of IR light. These are primarily used to image gasses and diagnose their composition. Dr ...
Leti claims 3D chip breakthrough on 300mm wafers
Leti, an institute of CEA Tech, has announced the world’s first successful 300mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm and copper pads as small as 500nm. This was achieved in partnership with EV Group, a supplier of wafer bonding and lithography equipment. “To our knowledge, this is the first reported demonstration of sub-1.5µm pitch ...
Scottish team makes digital printing breakthrough for mass storage
Scientists at the University of Glasgow say they have developed a new form of high-resolution ‘printing’ which could have wide-ranging applications in data storage, anti-counterfeiting measures, and digital imaging. The research, published in the journal Advanced Functional Materials, describes the development of nano-scale plasmonic colour filters that display different colours depending on the orientation of the light which hits it. ...
French and German researchers collaborate on future chip technologies
Leti, the French semiconductor research institute, teams with Fraunhofer’s microelectronics group to extend next generation CMOS technologies for the IoT
Flanders ups Imec grant
Imec has its funding from the Flanders government increased to $108 million a year for the next five years.