Infineon is aiming at automotive power control with a 5 x 7mm top-side cooled surface-mount package, pitching it against the 5 x 6mm bottom-cooled SSO8. The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing ...
Renesas Electronics is part of a consortium building an OSAT (outsourced semiconductor assembly and test) facility at Sanand near Ahmedabad in Gujarat India. It will only hold around 6.8% of the equity capital, with the bulk going to Mumbai engineering conglomerate CG Power and Industrial Solutions. Thailand OSAT provider Stars Microelectronics will hold 0.9%. “CG’s entry into the semiconductor manufacturing ...
NASA, Texas Instruments and others in the space industry have created a qualification standard for using plastic packaged ICs in space: Qualified Manufacturers List Class P – QML Class P. “QML Class P was designed in league with NASA and other industry experts as a plastic packaging standard for space electronic,” TI told Electronics Weekly. The standard is based on ...
Infineon has put 650V mosfet die from its CFD7A portfolio into a surface-mount package with “improved electrical performance over the well-known TO247 through-hole devices, thus enabling efficient energy utilisation in onboard chargers and dc-dc converters”, it said. ‘QDPAK TSC’ is a top-side-cooled package (see images) announced earlier this year and now registered with JEDEC – at the same time it ...
Toshiba has launched a 200A 40V 0.66mΩmax automotive grade n-channel mosfet that can handle 600A pulses in a 7 x 8.44 x 2.3mm gull-wing package. “Automotive safety-critical applications such as steering, braking and autonomous driving systems generally require more devices than other systems to meet redundancy requirements. Here, a power mosfet with high current density is required due to the ...
Laird Thermal Systems has created a series of multi-stage thermo-electric coolers for miniature optical packages. MSX Series have cold-side footprints down to 2 x 4mm, and thicknesses down to 3.3mm for two stages, 3.8mm for three stages and 4.9mm for four-stage coolers. It has the “capability to integrate them into various optical packages, including TO-39, TO-46 or TO-8”, according to the ...
Toshiba has created a gull-wing mosfet package specifically for high current automotive applications, and has released a 400A 40V mosfet in it. Branded L-TOGL and measuring 9.9 x 11.8 x 2.3mm (right), the AEC-Q101-capable package is designed for up to 175°C, 100V, 400A, 750W, with minimum mosfet device Rds(on) around 300μΩ. This compares with 250A, 372W and ~740μΩ from the ...
Alter Technology has started its plastic die packaging line in Livingston. “We have set up the UK’s only QFN plastic package semiconductor line, which has a capacity of several million single die QFN-equivalents per year, with plans to go beyond 10 million next year,” said company CEO Stephen Duffy. “While still a long way off the capacity of the big ...
Nexperia has introduced 30V and 12V n-channel trench mosfets in 1mm packaging. In 1 x 0.6 x 0.2mm DSN1006: PMCB60XN 30V, 4A, 50mΩ (4.5Vg) PMCB60XNE 30V, 4A, 55mΩ (4.5Vg), 2.5kV HBM ESD protection “This gives them the lowest on-resistance per die area among similar 30V mosfets in the market,” claimed the company. In 0.96 x 0.96 x 0.24mm DSN1006 (SOT8007) ...
Onsemi has put a 650V silicon carbide mosfet into a 9.90 x 11.68mm TOLL (TO-leadless) package “Until recently, SiC devices had been supplied in D2PAK 7lead packages,” according to the company. “The TOLL package offers 30% savings in PCB area over a D2PAK package, and at a profile of 2.30mm, it occupies 60% less volume.” Package inductance is 2nH, and a Kelvin ...
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