Manufacturing

The semiconductor industry is gearing up for the next generation 32nm designs and looking at 22nm, say leading executives, but key problems still remain

E2v Technologies is considering sourcing its volume low-cost components through a partner, a joint facility or its own facility in Mexico

The view that manufacturing is moving inevitably from Britain to lower-cost services based offshore may be true for mass-market products, but production of high-value, advanced technology products is actually growing in the UK.

TSMC has responded to the design community by coming up with a mechanism for delivering more manufacturing data to designers.

For the first time Taiwanese foundry TSMC will get into volume production on a process node at the same time as the leading integrated device manufacturer (IDM) Intel

The National Physical Laboratory (NPL) is to look into electromigration in high-density interconnect

The ambitions of the semiconductor foundry firms to move in to the design environment was a central theme of the IEF 2007 conference in Athens, Greece, last week

As semiconductor companies increasingly go fab-lite and fabless, the answer to their being able to deliver value to customers is their software, it was said at IEF2007 this morning

Renesas Technology will not be following other chip firms in pulling out of doing basic process R&D

UK contract electronics manufacturer ACW Technology has opened its own volume facility in Zhuhai, China to get to a market that it previously could not reach