Zytronic will be demonstrating is ElectroglaZ high-current transparent conductor technology using this hi-fi (right) at Light + Building in Frankfurt. The hi-fi system is intended to show “how the technology can simultaneously power a set of floating Bluetooth speakers and an LCD”, according to the company. “In addition, the system integrates Zytronic’s projected capacitive touch technology with carved features on ...
Manufacturing
Plastic die packaging now in Scotland
Alter Technology has started its plastic die packaging line in Livingston. “We have set up the UK’s only QFN plastic package semiconductor line, which has a capacity of several million single die QFN-equivalents per year, with plans to go beyond 10 million next year,” said company CEO Stephen Duffy. “While still a long way off the capacity of the big ...
Kyocera to build new MLCC plant
At a signing ceremony yesterday with Kagoshima Governor Koichi Shiota, Kirishima City Mayor Shinichi Nakashige, and Kyocera officials, the company undertook to construct a new production facility at its Kokubu Plant Campus in Kagoshima, Japan. Construction will begin in February 2023 and the plant will begin operation in May 2024. The new plant will be located on the current site ...
Reshoring, nearshoring or offshoring – why should engineers care?
Is the electronics industry changing its stance on manufacturing in the Far East? Dan Attewell believes constant evaluation is vital to assess and indicate business direction. This question has been asked countless times, but has failed to receive a definitive answer – partly because it changes depending on the current state of the market and who is answering. Some argue ...
Italy may pay 40% of Intel assembly plant cost
Italy looks like following the example of Germany and paying 40% of the cost of an Intel plant. Germany is paying Intel $7.3 billion towards the $19 billion cost of a fab-site at Magdeburg. According to Reuters the plan to build the $5 billion Intel packaging plant in Italy is set to be completed by the end of this month. ...
Ceramic for stable force measurement
Bosch Advanced Ceramics is making Wheatstone bridges to measure deflection in pressure sensors. “It does this permanently and constantly,” said Bosch, “and, unlike electrical insulation or a metal resistor, the signal cannot be distorted with technical ceramics.” The image is a demonstration tile with eight ceramic Wheatstone bridges.
CEM Nemco joins Manufacturing Assembly Network
Contract electronics manufacturer Nemco has joined the Manufacturing Assembly Network (MAN), the collective of eight sub-contract manufacturers and and an engineering design agency. As well as electronics manufacture services, MAN offers automation systems, control systems, precision machining, aluminium casting, forging, high-volume pressing, plastic injection moulding, tube manipulation and welded assembly. Its members employ more than 1,750 people across 13 largely ...
Solid State Plc to buy battery systems manufacturer Custom Power LLC
Worcestershire Solid State has entered into a conditional agreement to acquire Californian battery systems manufacturer Custom Power, for a maximum consideration of $45m. “In particular, the move will bring new and increased capabilities, specifically within the defence, medical and industrial markets”, according to Solid State. “After lengthy negotiations, we are delighted to be able to announce this,” said Solid State ...
Skyrora starts rocket production in UK’s largest engine manufacturing facility
The Edinburgh-headquartered space company Skyrora begins rocket production in what it describes as the UK’s largest engine manufacturing facility in Cumbernauld, in Scotland’s Central Belt. The new Skyrora Vehicle Assembly Building consists of 55,000 sq ft of factory floor and office space, along with a 67,000 sq ft yard large enough to contain the entire Skylark L launch complex and ...
ST and GloFo to expand Crolles
ST and GlobalFoundries are to build a 300mm fab at Crolles. The fab will support a range of technologies, including FDSOI, down to 18nm. There will be significant financial support from France for the project which is costing $5.7 billion. The fab is targeted to ramp to full capacity by 2026, with up to 620,000 300mm wafer per year production at ...