Manufacturing

Intel is to team up with French lab CEA-Leti to put two-dimensional transition-metal dichalcogenides on 300mm wafers. The aim of the multi-year project is to develop a way to transfer layers of 2d material, grown on substrates up to 300mm, to a second substrate for transistor building. Intel will supply manufacturing expertise and CEA-Leti has bonding, layer-transfer and characterisation knowledge. ...

A novel approach from Siemens and PDF Solutions improves yield ramp on advanced nodes and solves yield limiters through volume manufacturing. Improving yield is key to reducing manufacturing cost and maximizing profits in a highly competitive semiconductor market. While large yield limiters are addressed early in the process during yield ramp, subtle systematic layout patterns continue to cause physical defects ...

Flex has manufacturing operations in more than 30 countries and is encouraging suppliers to adopt and share data on effective sustainability practices. Interview by Caroline Hayes. Lynn Torrel has been in the post of chief procurement and supply chain officer at EMS/ODM, Flex, since October 2019, and is responsible for materials management, transportation and logistics, and the strategic supply chain. ...

To meet near-shoring requirements of European customers, Malaysian EMS (electronics manufacturing services) provider Escatec has established a production facility in Plovdiv Bulgaria. This is the company’s ninth production site globally, and adds to a site in the UK, two in the Czech Republic, one is Switzerland and four in Malaysia. It also has a design centre in Switzerland, and partnerships ...

Electronics manufacturing SMEs from the Northern Powerhouse region have gathered in Leeds to boost their exports to Australia, supported by Lord Botham, formerly cricketer Ian Botham, the UK Government’s trade envoy to Australia. “The round-table included 20 UK business heads, representing a mix of businesses who either already export to Australia and New Zealand, or are eyeing the region for ...

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], so that high-density digital logic ...

Custom battery pack manufacturer Alexander Battery Technologies has opened an e-mobility battery engineering and production unit on its Peterlee campus in County Durham. “The Battery Technology Centre will add engineering and service capabilities as the company begins its first projects, developing and prototyping for e-mobility customers,” according to the company. “The 1,850m2 [20,000ft2] centre complements the company’s existing facilities in ...

To get the best out of GaN power transistors, which are far faster than silicon or silicon carbide transistors, microwave design techniques including RF simulation is essential, according to Cambridge start-up QPT. Final assembly, EMC screen partially lifted The alternative is to slow operation until the advantages of GaN fade away, or to risk durability as unseen ultra-fast overshoot and ...

Working for consumer brand Melitta, Trojan Electronics in Swansea has rebuilt and repaired warrany returns to create almost 500 like-new bean-to-cup coffee machines. Parts such as coffee grinders, water tanks and sensors units were harvested from beyond-repair items and used to repair other units, according to Trojan. As part of the process, which has created 484 machines, it said, each ...

GlobalFoundries, Samsung and TSMC have joined imec’s Sustainable Semiconductor Technologies & Systems (SSTS) research programmr. Launched in 2021, the SSTS program rallies stakeholders from across the semiconductor industry – including systems companies, (equipment) suppliers, and now also three of the world’s leading semiconductor foundries – to help reduce the ecological impact of the IC value chain. In response to mounting ...