Attaching up to 60,000 flip-chip dies per hour

“Instead of the traditional forwards and backwards up-down linear motion, the new die bonder employs two rotating heads to pick, flip and place the die in a fast, smooth action,” according to the company. “This mechanism reduces inertia and vibration, allowing for the same accuracy at much higher speeds. This development opens up new opportunities for chipmakers to transition their high-volume wire-bonded products to flip-chip technologies.”

Wafers from 200 to 300mm can be accepted, and accuracy is better than 5μm at 1σ, it added.

Die can vary across 0.2 x 0.2 to 3 x 3mm, with aspect ratios up to 1:3, and between 50 to 400μm thick.

Leadless and leaded packages including types of QFN, DFN, HVQFN, SOT, SO, TSSOP and LGA can be handled, and 100 x 300mm strips.

Monitoring includes five cameras, monitoring: glue, pre-pick, back, top and post-bond.

A separate flux screen printer can be added in-line, or the unit can run stand-alone tool with strip magazine input-output, and a flux screen print inspection module is an option.

The machine measures 3 x 2.1 x 1.25m and 3,000kg, or 0.5m longer with the magazine loader fitted.

Back-end semiconductor equipment manufacturer ITEC is headquartered in Nijmegen, the Netherlands. It has history with Philips and Nexperia, and became a separate legal entity in 2021.

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