Siemens EDA for Intel 16 and 18A nodes

Siemens Digital Industries Software and Intel Foundry have certified Solido EDA software for Intel’s 16 and 18A nodes and enabled an embedded multi-die interconnect bridge (EMIB) that can help customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs more quickly.

Intel 18A is the latest node in Intel Foundry’s process technology roadmap, featuring RibbonFET GAA transistor architecture and PowerVia backside power delivery technologies. Intel 18A and Intel 16 are also now enabled with Open Model Interface (OMI), the industry-standard platform for enabling aging modelling and reliability analyses, supported by Siemens’ Solido Simulation Suite.

Siemens has also announced the availability of the EMIB reference flow that can help Intel Foundry’s customers utilise the foundry’s EMIB approach to in-package, high-density interconnect of heterogeneous chips.

With an Intel Foundry developed and supplied Package Assembly Design Kit (PADK), Intel Foundry’s EMIB customers can also leverage Siemens’ Calibre nmPlatform to validate the EMIB silicon layouts for DRC, LVS, and 3DThermal analysis.

Mutual customers can also conduct package and substrate system planning, design, and verification using Siemens’ Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx SI/PI software, and Calibre 3DSTACK software — leveraging the technology of Siemens’ IC and semiconductor packaging portfolios, which provide  package assembly prototyping and floorplanning with Xpedition Substrate Integrator and predictive shift-left multi-physics analysis from Calibre.