Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking within ICs, and for adding back-side power networks to die. Top and bottom wafers bonded by contact at room temperature, and then annealed. Migrating from the usual square array of wafer-to-wafer interconnects, these are in a ...
87% of people trust engineers to tell them the truth, after nurses an 89% and before doctors at 85%, according to the Institution of Engineering and Technology (IET). “Engineers are one of only three professions whose trust score has improved since 2021,” it said. “Out of a list of 30 different professions, engineers are the second most trusted in Great ...
After a tough three years, microcontrollers are expected to grow 6% this year to $16bn, 7% next year and 9% in 2016 after a flat 2013 and a 3% fall in 2012, says IC Insights.
The global optical components (OC) market will grow 8% in 2014, says Ovum.
The transition to SuperSpeed USB is occurring more rapidly than previously anticipated, said market research firm In-Stat, due primarily to quicker integration of the new standard into core logic chipsets. Annual growth rate is predicted to be...
LEDs will become the dominant lighting technology, claims market analyst Frost & Sullivan. "The world LED market will expand strongly, driven largely by improvements in technology," said analyst...
Consumers will spend more than $100bn on flat panel TVs during 2007, according to a report from market watcher Strategy Analytics
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