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Monthly Archives: February 2020

Maxim announces two LiDAR ICs at Embedded World

lidar

Maxim launched two LiDAR ICs at Embedded World this year, the Max400026 comparator and Max40660/Max40661 transimpedance amplifiers. The manufacturer is claiming these ICs represent a twofold increase of bandwidth and, at 128, an additional 32 channels over the nearest competitor in the same size module. The Max40026 is provided in a TDFN package size of 4mm2 while the 40660/1 come ...

Rosebuds

Last week the pubs of Towcester were probably en fete as the 33 designers of Phoenix VLSI were lured by a cool $35m to join TI. That was in July 2000 – a golden year for the tech industry when Arm IPO’d at a valuation of £9 billion, Bookham  at a valuation of $7 billion and Infineon at a valuation of €45 ...

Pope pronounces on AI

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The Pope is issuing guidelines on the use of AI. IBM and Microsoft helped in drafting the Pope’s pronouncement entitled: “Rome Call for AI Ethics”. The Pope’s message is that AI should: be transparent respect privacy consider the needs of all human beings work without bias & work reliably The pope warned that algor-ethics –  ethical algorithm development – should ...

New dates for Light + Building in Frankfurt

The corona virus postponed Light + Building exhibtion will take place from 27 September to 2 October 2020. For the uninitiated, it is a trade fair for lighting and building services technology at Messe Frankfurt. Existing visitor tickets for March 2020 will be valid in September 2020.

Kioxia plans $32bn IPO in October

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Kioxia, the renamed memory division of Toshiba, plans to raise $31.8 billion in an IPO on the Tokyo Stock Exchange in October, reports the Nikkei. The IPO would deliver a big profit to the consortium led by Bain and Hynix which bought Toshiba Memory for $18 billion in May 2018. Nine underwriters have been selected including Goldman Sachs, Morgan Stanley, ...

eMRAM available on GloFo’s 22nm FD-SOI process

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Globalfoundries is offering eMRAM on 22nm FD-SOI. The company is working with several clients with multiple production tape-outs scheduled in 2020. The technology shows the scalability of eMRAM as a cost-effective option at advanced process nodes for IoT, general-purpose MCU, automotive, edge-AI and other low-power applications. Designed as a replacement for high-volume embedded NOR flash (eFlash), GLoFo’s eMRAM allows designers to ...

ADI and Marvell co-developing 5G base station chips

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ADI and Marvell  are co-devloping chips for 5G base stations. The companies will offer integrated 5G digital front-end (DFE) ASICs with RF transceivers and will collaborate to develop next generation Radio Unit (RU) solutions including baseband and RF technology. “Marvell’s leadership in baseband, digital ASIC and transport processors combined with ADI’s RF transceiver technology creates an industry-leading architecture for 5G OEMs ...