GenAI for procurement is at the Peak of Inflated Expectations, according to Gartner’s 2024 Hype Cycle for Procurement and Sourcing Solutions. Rapid adoption and a multitude of credible use cases will quickly move GenAI to the Plateau of Productivity within two years. ”GenAI can already enhance many different workflows in procurement and 73% of procurement leaders at the start of ...

Three exciting new categories in Electronics Weekly’s Elektra Awards 2024 highlight the changing landscape of electronics. Reflecting changes in the electronics industry, this year there will be the Best Workplace Award, the Smart Buildings of the Year Award and the Futurist Award for new and emerging applications, such as AI, VR/AR, robotics. These categories join Elektra ‘classics’ for Semiconductor Product ...

TSMC will break ground on its first European fab in August, reports the Nikkei, with TSMC chairman and CEO C.CWei attending, “TSMC plans to hold the groundbreaking ceremony for the ESMC’s fab in Dresden, Germany, on August 20,” says TSMC, “this event represents a significant milestone for TSMC and our investment partners in the European semiconductor industry. The ESMC project ...

Teledyne e2v Space Imaging is collaborating with Starris Optima Space Systems to develop space cameras for small satellites and lunar ecosystems. “Our joint development of these compact camera payloads begins to address a growing and significant market as small sat applications move beyond LEO into the cislunar economy, which is a steppingstone to Mars habitation,” says Teledyne vp Antonino Spatola. ...

Binder is adding an M8 12-pin circular connector to its industrial portfolio. Featuring 12 pins on the compact M8 connector face, the connectors are aimed at projects requiring miniaturisation. Applications suggested by binder include industrial sensor technology, measurement and control, in camera technology and robotics. Miniaturisation “The future of automation lies, among other things, in miniaturization, for which we are ...

Molex has  brought out its Percept Current Sensors to provide busbar current sensors in industrial and automotive applications. The sensors combine Infineon’s coreless current sensors and Molex’s electronics packaging to  reduce size and weight while simplifying installation and system integration. This enables higher-density packaging within devices, reduced weight and greater design flexibility. The devices offer increased sensing opportunities in space-constrained applications as ...

Thanks to TrendForce for this one – the top ten foundries in Q1:

CUI Devices has added tweeters to its range of loudspeakers. Called the CTW range, there are six tweeters, measuring from 30.5 x 30.5mm to 58.8 x 58.8 mm, and between 13.5 to 24mm from front to back. Oval, rectangular and round frame shapes are available, some with ferrite magnets and others with neodymium types, with cones of and paper, polyester ...

Trainium and Inferentia sound like a couple of Roman matrons you see in tongue-in-the-cheek dramas about Ancient Rome. Trainium maybe a bit of a dom, Inferentia more of a snidey gossip. They are Amazon’s names for its AI chips – one for training AI programmes, the other for inferencing – running the programmes. When the tech evolves a bit more ...

Microchip Technology has announced a 32bit 200MHz version of its dsPIC33 series of DSP-heavy MCUs. dsPIC33A, as the family will be called, is aimed at fast closed-loop control of PSUs and motors. As with earlier dsPIC processors, the parts remain a combination of CPU and maths accelerator (‘DSP engine’), rather than a pure DSP architecture. In this fifth generation, the ...