HBK is introduced a flange-mount sensor for tensile and compressive forces. Called U93A, and a more accurate update on the U93 sensors, there are two basic versions: 35mm diameter for 1 to 10kN, and 54mm diameter for 20 to 50kN. “Its small dimensions and dynamic properties make it an alternative to piezoelectric force sensors,” according to the company. “The mechanical ...
Monthly Archives: April 2024
Japan partners a quantum computer with a supercomputer
Japan’s National Institute of Advanced Industrial Science and Technology (AIST) is spending Y6.5bn (~$41m) on a quantum computer from Massachusetts-based QuEra Computing. It will be installed alongside an Nvidia-based supercomputer called ABCI-Q. The aim is to “develop a hybrid quantum-classical computing platform, where quantum computing technology complements AIST’s ABCI-Q supercomputer with the goal of creating a platform for high-fidelity simulations ...
US-China Trade Deficit Narrows
The U.S. trade deficit in goods trade with China narrowed to its lowest level since 2010 last year, as imports from China fell by more than $100 billion compared to the previous year. According to the U.S. Census Bureau, the deficit with China decreased more than 25 percent to $279 billion in 2023, as tensions – both economic and political ...
Glenair series 806 Mil-Aero connectors from Powell Electronics
Powell Electronics is stocking series 806 Mil-Aero connectors from Glenair. “The products offer significant size and weight savings while meeting key performance benchmarks for a broad range of applications such as commercial and military aerospace, industrial robotics, transportation systems and more,” according to the component distributor. Designed for use in harsh vibration, shock and environmental settings — as well as ...
400nm pitch wafer-bonded conductors for memory-on-logic ICs
Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking within ICs, and for adding back-side power networks to die. Top and bottom wafers bonded by contact at room temperature, and then annealed. Migrating from the usual square array of wafer-to-wafer interconnects, these are in a ...
BEC Distribution announces alternatives for Murata fixed inductors
Alternatives for Murata’ LQH series of fixed inductors are available with short lead times of between five to seven weeks, announced BEC Distribution. The wire wound, surface mount fixed inductors have a high Q value for low resistance and also have a high inductance for filtering high frequency noise. A spokesperson told Electronics Weekly that typical specifications include an operating ...
Samsung Q1 profit up 10x
Samsung reported a 10x increase y-o-y in Q1 operating profit of $4.8 billion on revenue up 13% at $52.14 billion. Memory revenues were up 96% at $12.7 billion. The semiconductor business made a Q1 profit of $1.4 billion. “We plan to increase supply of HBM-related chips in 2024 by more than three-fold versus last year,” said Samsung vp Jaejune Kim, ...
Massive MIMO units to grow 3x 2023-31
Massive MIMO will consolidate its position in 5G RAN and increase its rate of growth in all markets, with total units installed per year rising just over 3x – from 930,000 in 2023 to 3.07 million in 2031. By then, the cumulative number of mMIMO units deployed globally will be around 22 million. Deployments will be more concentrated in denser ...
Infineon integrates ESCRYPT into AURIX
Infineon has integrated the ESCRYPT CycurHSM 3.x Automotive Security Software Stack into the AURIX TC4X Cybersecurity Real-time Module (CSRM) in collaboration with ETAS, a provider of automotive software. The AURIX TC4x family is compliant with the latest ISO/SAE 21434 cybersecurity standard. The security concept eliminates performance bottlenecks and supports post-quantum cryptography. The controller family includes a Cybersecurity Real-time Module (CSRM) ...
Apple takes China hit
Q1 China smartphone shipments grew 6.5% year over year (YoY) to 69.3 million, says IDC. The market saw better-than-expected shipments mainly driven by strong growth from Honor and Huawei, which also spurred a 9.3% YoY growth in the overall Android market. Apple declined 6.6% over the same period as it faced more intense competition.