Electronics Weekly Electronics Design & Components Tech News
It is not as common as it once was for companies to launch products at exhibitions, but Renesas is launching a new, low-power microcontroller series at the show. It will also be showcasing its RZ/V2H microprocessor with new AI technology.
Renesas: Hall 1-234
Silicon Labs will highlight its recent introductions, the xG27 family of SoCs including the BG27, for Bluetooth connectivity, and the MG27, which supports Zigbee and other proprietary protocols.
Silicon Labs: Hall 4A-128/129
The automation industry will be addressed by Microchip, with new dsPIC DSC-based integrated motor drivers. They incorporate a dsPIC33 digital signal controller, a three-phase mosfet gate driver and optional LIN or CAN FD transceiver in a single package to meet the space constraints of real-time embedded motor control systems.
There are also the accompanying dsPIC33CK motor control starter kit and the MCLV-48V-300W, dsPIC33-based integrated motor driver development boards.
The company will also announce a new 8-bit microcontroller at the show.
Microchip: Hall 3A-135
Several themes will merge on a single stand as Texas Instruments focuses on advances in robotics, energy transition and electric vehicles. This makes sense, as Amichai Ron, senior vice-president, TI Embedded Processing, points out that embedded processing is redefining industrial and automotive applications “Whether it’s a robotic arm, a software-defined vehicle or an energy storage system, a vast array of subsystems and features are enabling more sensing, motor control, communications and edge-AI capabilities than ever before,” he says.
Visitors will see demonstrations of embedded Arm-based processors with integrated AI accelerators that can run up to three displays simultaneously for complex HMI systems. The company has added more than 100 microcontrollers to its Arm Cortex-M0+ portfolio since last year’s Embedded World, for use in industrial, medical and automotive systems. The company will also highlight integrated embedded processors, including the TDA4VM for autonomous mobile robots and its bi-directional, GaN-based solar microinverter, which uses wireless connectivity to monitor and manage system voltage.
The company recently introduced 100V GaN power stages, LMG2100R044 and LMG3100R017. The 1.5W isolated DC-DC modules are claimed to be the industry’s smallest and deliver over eight-times higher power density for automotive and industrial applications. The company claims that the modules can reduce overall size by 40% and increase power efficiency with 50% lower switching losses.
Texas Instruments: Hall 3A-131
Embedded boards
Computer on modules (CoMs) are the bread and butter of this event and congatec will exhibit its portfolio including Intel Core Ultra processor-based modules with integrated AI. The company will present the energy efficiency and integrated IIoT and security functions, which it says have not been part of any existing CoMs offering before, and which make them suitable for multifunctional, connected embedded and IIoT devices, it adds.
Congatec: Hall 3-241
Industry group PICMG will announce a new relationship with the DMTF (Distributed Management Task Force) and a partnership with OPAS as part of its new InterEdge standardisation initiative for real-time process communication. It will have information on the latest standard updates and new initiatives.
PICMG: Hall 5-342
Open standard modules will be launched by Adlink. The company describes the product line as “featuring versatile standards for small-size and low-cost soldered-down embedded modules that are fully machine processable during soldering, assembly and testing”. Its new edge computing platforms will debut at the show. These integrate Arm, Intel and Nvidia technologies for industrial applications. The company will introduce the ASD+ industrial-grade high-performance enterprise SSD family series.
Adlink: Hall 3-147
Embedded software
Kudelski IoT will elaborate on its IoT device security initiative, established with semiconductor partners STMicroelectronics, Infineon, Microchip, Qorvo and Silicon Labs.
This initiative aims to enhance secure IoT device identity provisioning and introduce robust support for matter across semiconductor products.
Kudelski IoT: Hall 5-176
Still with protection, Codasip will demonstrate its CHERI technology, designed to prevent common cyberattacks. It recently added built-in fine grained memory protection to its 700 processor family by extending the RISC-V ISA with CHERI-based custom instructions. This and hardware/software optimisation will be demonstrated on the stand.
Codasip: Hall 4-368
Embedded World 2024
Embedded World takes place from Tuesday 9 to Thursday 11 April at the Exhibition Centre, Nuremberg, Germany.
The three-day conference, which runs alongside the exhibition, will include a keynote from Dr Salil Raje, senior vice-president and general manager of the Adaptive and Embedded Computing group AMD (Tuesday 9 April) on improving efficiency in the context of AI and in particular the differences and interaction between edge and cloud computing.
A second keynote will be Fiona Treacy, managing director within the Industrial Automation business unit, Analog Devices (Wednesday 10 April), providing an insight into how the factory of the future can be designed sustainably with the help of the intelligent edge.
