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Tag Archives: NXP

Electronica: ASIL D vehicle battery safety monitor and pyrotechnic trigger

NXP MC33777 battery box monitor IC

NXP is aiming at ASIL D safety approval with a vehicle battery junction box controller IC, intended to fire the pyrotechnic disconnect switch during a serious fault, as well as report faults over a serial bus. MC33777A, as it will be known, redundantly measures currents, voltages and temperatures, then deduces situations – a short circuit or a crash, for example ...

IC promises UWB radar for smart home automation

NXP UWB radar application image

NXP has combined short-range 6 – 8.5GHz UWB radar, secure ranging and angle-of-arrival processing on a single chip. Called SR250, it is for “a world that anticipates and automates, enabling a variety of new user experiences based on location, presence or motion detection across consumer or industrial IoT applications”, claimed the company. It is said to support 3D angle-of-arrival and ...

Embedded World: Debug and trace for S32N55 vehicle processor

PLS debug and trace for NXP S32N55

Programmierbare Logik & Systeme is offering debug and trace for NXP’s S32N55 16 core software-defined vehicle processor, announced yesterday. It is included in the 2024 version of UDE, the company’s universal debug engine. With UDE “the Cortex-R52 main cores and the Cortex-M7 auxiliary cores are all visible and can be controlled from one common debugger user interface”, according to PLS. ...

NXP reveals MCX MCUs with Matter, Thread, Zigbee and Bluetooth LE

NXP MCX W72x wireless mcu block

NXP has finally revealed the wireless versions of its MCX microcontrollers, first announced in mid-2022. “Featuring the industry’s first MCU with Bluetooth Channel Sounding, NXP’s MCX W series enables edge devices with secure multi-protocol wireless for Matter, Thread, Zigbee and Bluetooth Low Energy,” according to the company, which explained: “Bluetooth Channel Sounding standard improves the accuracy and security of distance ...

NXP reveals the low-cost MCX MCU series

NXP MCX A14x A15x mcus block

NXP has fleshed out the MCX A microcontroller series it announced in 2022. The ‘A’ series is the lower-cost branch of the MCX family, and like other MCX MCUs, the devices are built around an Arm Cortex-M33 core – this is the security-enabled M3. The first parts are MCX A14x (48MHz core) and MCX A15x (96MHz core), which come in ...

NXP to implement distributed aperture radar for automated driving

Zendar distributed aperture radar picks out cars in a street

NXP has invested in a high-resolution distributed aperture radar software start-up, and will use its software in ICs for vehicle radar. “Distributed aperture radar offers a path to enhance the resolution of radar systems while eliminating the need for thousands of antenna channels,” according to NXP. “It coherently fuses information from multiple radar sensors on a vehicle to create a ...

Qualcomm and Google to develop RISC-V for wearables

Google-Wear-6-0-300x200.jpg

Qualcomm is to create RISC-V based silicon for wearables, working with Google to optimise it for Google’s Wear OS. “We are excited to extend our work with Qualcomm Technologies and bring a RISC-V wearable solution to market,” said Google general manager Bjorn Kilburn. Leading up to this, the companies will continue to invest in Snapdragon Wear platforms for the Wear ...

Arm panel PC has neural processing and PoE for industry

Estone Ppc4910 Arm AI panel PC

Estone Technology has introduced a range of Arm processor 10.1in touch-panel PCs for industrial AI applications with neural network processing, camera interfaces and power-over-Ethernet. Called PPC-4910, computing comes from NXP’s i.MX8M Plus 1.8GHz quad Cortex-A53 core processor, which has an integrated AI/ML neural processing unit (NPU) operating at up to 2.3Top/s “that focuses on edge AI, vision processing and other ...

Single core Cortex-A55 option for system modules and single-board computer

iWave i.MX-91 single board computer

iWave has added an NXP i.MX 91 option to its iW-RainboW-G50M family of OSM v1.1 solderable LGA system-on-modules. These recently introduced processors flesh-out the low end of NXP’s i.MX 9x range with a single Arm Cortex-A55 core, intended to run Linux in edge devices. As well as the 45 x 45mm (size L) system-on-module, iWave has created a 100 x ...

NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations

NXP top cooled rf

NXP has announced a family of top-side-cooled RF amplifiers, intended to shrink and lighten radios for 5G infrastructure – the company is claiming a reduction basestation thickness and weight of over 20% compared with those made with its bottom-side cooled amplifiers. It is aiming at active MIMO (multiple input multiple output) antenna arrays, where using a top-side cooled amplifier (‘PA’ ...