Tag Archives: congatec

Congatec has introduced COM Express Type 6 Compact computer-on-modules with AMD Ryzen Embedded 8000 processors, offering up to 39Top/s for AI processing. The processors have up to eight Zen 4 cores, 16Top/s XDNA NPUs and AI-capable Radeon RDNA 3 graphics with up to 12 compute units, and are available with design powers from 15 to 54W (see table below). Conga-TCR8 ...

Congatec announced SMARC modules based on Intel’s Atom x7000RE ‘Amston Lake’ processors. “Specially designed for industrial requirements, they deliver eight processor cores, double the previous generation, while maintaining the same power consumption,” according  to Congatec. Called conga‑SA8, the modules are credit card size and operate over -40 to +85°C. Read all the latest news from Embedded World 2024 » AI ...

Congatec is to ship an installed hypervisor with many of its x86 computer-on-modules as standard. The hypervisor in question is related to RTS Hypervisor from Real-Time Systems – a company owned by Congatec, and installed as part of the BIOS. “It uses the same technology as RTS Hypervisor, but it is integrated in the modules” the company told Electronics Weekly, ...

A range of COM Express modules released by congatec are based on the Intel Core Ultra processors, which integrate a neural processing unit (NPU) called Intel AI Boost. According to congatec, the conga-TC700 COM Express Compact Type 6 computer on modules (CoMs) can be used to integrate AI workloads with lower system complexity and costs than using discrete accelerators. c ...

Congatec has introduced COM Express Type 6 modules with Raptor Lake (13th generation) Intel Core processors, intended for rugged use over -40 to +85°C. “Equipped with soldered ram, the computer-on-modules provide compliance for shock and vibration resistant operation in harsh environments up to highest railway standards,” claimed the company. “Target applications are manned and unmanned rail and off-road vehicles for ...

PICMG has ratified the COM-HPC 1.2 computer-on-module specification, which introduces the COM-HPC Mini form factor. “This provides high-performance capabilities in a small form factor, measuring only 95 x 70mm,” according to COM-HPC module maker Congatec. “Even devices with limited space can now benefit from the superior bandwidth and interface offerings of COM-HPC, including PCIe Gen 5 and Thunderbolt.” COM-HPC Mini ...

Congatec is adding Texas Instruments processors to its portfolio of Arm-based single board computers. Conga-STDA4 is the first, a SMARC computer-on-module with TI’s industrial-grade TDA4VM processor, which has dual Cortex-A72 cores and is aimed at industrial mobile machinery requiring near-field analytics – automated guided vehicles, autonomous mobile robots, construction machinery and agricultural machinery, for example. There are also six 1GHz ...

At Embedded World 2022 in Nuremberg we took advantage of the show to interview Zeljko Loncaric, a Marketing Engineer at Congatec. Talking points in the interview include computer-on-modules and COM-HPC, moving beyond maker boards, listening to the customer, and working at the Edge. Thank you to Zeljko for his time. Read all our Embedded World 2022 coverage » Congatec is ...

Congatec is aiming at high-end industrial workstations and desktop clients with a Micro ATX-compliant carrier board with a COM-HPC interface – avoiding committing to a specific BGA or LGA processor. “As it is processor socket and vendor independent, the board can be equipped with any computer-on-module available in COM-HPC Client Size A, B or C,” according to the company, which ...

Congatec is aiming at mixed-criticality edge servers with COM-HPC Server size D (160 x 160mm) board with Intel Xeon D-2700 (Ice Lake D) processors. Processors with up to 20 cores are available, alongside four DRAM modules – half the number available on the larger size E COM-HPC Server modules. Up to 512Gbyte of DDR4 RAM at 2,933Mtransfer/s can be found. “Mixed-critical edge server applications ...